Abstract:
With the increasing advancement in technology, the conflicting challenge is removing the heat for high performance and a reduction in power consumption. Hence extensive research is being done in this field to find an efficient way to remove the heat from the compact system and increase its efficiency. Computational numerical analysis was performed in this study to dissipate the heat generation from electronic components by using pin fins with different geometrical protrusions. k – ω with shear-stress transport (SST) model is used with low Reynolds number correction. This model gives accurate formulation near wall region. Simulation is based on 6 different velocities along x-axis. Validation is based on Kai-Shing Yang et al [1] experimental data. 5 different types of geometrical protrusions are introduced. For efficient heat transfer, pin fins are arranged in a staggered pattern. In a 470mm long fluid domain, the output of pin fins was investigated for a range of 6 different velocities from 1-6m/s. A constant amount of 25W heat is applied to the base layer. Thermal performance of pin fins is augmented by the introduction of different geometrical protrusions on the surface of fins along the length, in 3 rows, each row having three protrusions with 120O apart. The optimal pin fin configuration with cylindrical profiles greatly improved heat transfer co-efficient, while the square form shows a large amount of pressure drop. Moreover, the porous geometry is showing higher thermal performance which attributes to higher convective heat transfer and lower pressure drop and facilitates the favorable flow behavior.
