Abstract:
The implementation of the 4th industrial revolution has normalized the extensive use
of energy-intensive electronics devices that has drastically increased the need for heat
dissipation. The development of these high-performance devices has outpaced the
research and development of their cooling schemes. This study aims to understand the
cooling scheme of pool boiling and its effects on the heat transfer surface. The
superheat surfaces used in the process of boiling are subjected to thermal and
mechanical stresses for an extended period. In this study material characterization
techniques of electron microscopy and contact angle measurement were employed
along with the heat transfer measurements to study the effect of aging on the pool
boiling surface. This study draws a comparison between the performance degradation
induced by the boiling on the plain surface as well as on the sand blasted surface. The
experiments show that the heat transfer performance is greater at the start of the boiling
process as compared to the performance of the aged surface. It was also observed that
change in the composition of the oxygen on the surface plays a pivotal role in the
determination of the performance of the specimen. The surface roughness and surface
morphology also play a major part in the aging-induced heat transfer performance
degradation of the heating surface. This is the reason the sand blasted surface suffers
high degradation in terms of the heat transfer performance as compared to the plain
surface. The difference of HTC between pre and post-boiling plain copper is 36%
whereas for Sand blasted surface it is 66%.
