dc.contributor.author | Li, Er-Ping | |
dc.date.accessioned | 2025-01-29T05:56:29Z | |
dc.date.available | 2025-01-29T05:56:29Z | |
dc.date.issued | 2012 | |
dc.identifier.isbn | 978-0-470-62346-6 | |
dc.identifier.uri | http://10.250.8.41:8080/xmlui/handle/123456789/49308 | |
dc.language.iso | en_US | en_US |
dc.publisher | Wiley-IEEE Press | en_US |
dc.subject | Three-dimensional integrated circuits | en_US |
dc.title | Electrical Modeling and Design for 3D System Integration : 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC / | en_US |
dc.type | Book | en_US |