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Electrical Modeling and Design for 3D System Integration : 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC /

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dc.contributor.author Li, Er-Ping
dc.date.accessioned 2025-01-29T05:56:29Z
dc.date.available 2025-01-29T05:56:29Z
dc.date.issued 2012
dc.identifier.isbn 978-0-470-62346-6
dc.identifier.uri http://10.250.8.41:8080/xmlui/handle/123456789/49308
dc.language.iso en_US en_US
dc.publisher Wiley-IEEE Press en_US
dc.subject Three-dimensional integrated circuits en_US
dc.title Electrical Modeling and Design for 3D System Integration : 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC / en_US
dc.type Book en_US


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