Eco Pack: Eco-friendly Packaging Designed from Wheat Husk

Abstract

Abstract One time use of plastic has become a common practice these days. 40% of the plastic produced is for packaging, utilized only once and then discarded which does not easily biodegrade and breaks down into micro plastics that contaminate our environment. There is a dire need to reduce this practice and find sustainable solutions through ecofriendly materials. In this study, we explore alternate materials through research and experimentation. The main focus of the study is materials obtained from agricultural waste specifically wheat husk, and finding natural binding materials for adhesion. It can help reduce the overall plastic waste that accumulates in landfills and waterbodies and take centuries to decompose. Our results show that, wheat husk has constructional properties in comparison with other agricultural waste and is easily available in lower prices. Boards made from wheat husks can achieve thermal conductivity lower than 0.08W/ (mK) that ensures good insulation.