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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

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dc.contributor.author Juan Cepeda-Rizo, Jeremiah Gayle
dc.date.accessioned 2025-04-04T04:38:36Z
dc.date.available 2025-04-04T04:38:36Z
dc.date.issued 2022
dc.identifier.uri http://10.250.8.41:8080/xmlui/handle/123456789/51842
dc.language.iso en en_US
dc.subject Structural Electronic Packaging Analysis for Space and Extreme Environments en_US
dc.title Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments en_US
dc.type Book en_US


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