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Multiple Band Microstrip Patch Antenna for Satellite Communication

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dc.contributor.author Saleem, Asad
dc.contributor.author Aziz, Usama
dc.contributor.author Hanan, Fateh
dc.contributor.author Rashid, Sajawal
dc.contributor.author Supervised by Dr. Farooq Ahmad Bhatti
dc.date.accessioned 2020-11-04T05:17:46Z
dc.date.available 2020-11-04T05:17:46Z
dc.date.issued 2019-05
dc.identifier.other PTC-367
dc.identifier.uri http://10.250.8.41:8080/xmlui/handle/123456789/9369
dc.description.abstract The project basically revolves around the concept of introducing staircase shape at each edge of the patch of Microstrip Patch Antenna (MPA) which will operate in S-band (2-4 GHz), C-band (4-8 GHz) and X-band (8-12 GHz).Depending on the technological developments, the variety and quality of the antennas, small size and better gain are becoming most popular specifications of antennas. The Rogers RT/Duroid 5880 with relative permittivity 2.2 and height 1.55 mm will be used as substrate material for design of the proposed antenna. Coaxial probe feed will be used to feed the proposed antenna because this type of feed provides better impedance matching to source by varying the feed position. Microstrip Patch Antenna can be used in various wireless communication applications such as satellite, Radar, missile and aircraft. MPAs are called low profile antenna because these can be flush mounted on curved surface and they only require space for the feed line . Microstrip antennas are popular at frequencies above 100 MHz . Improper impedance matching and narrow bandwidth are two main disadvantages of MPA’s. There are two techniques to enhance the bandwidth, one is by using thick dielectric substrate and the second is by using slotted patch. The first technique is limited because the thick substrate require increased length of the probe feed which introduces large inductance and increase only a few percentage of bandwidth. The second technique (slotted patch) increases the bandwidth more than the first method, reduces the size of the patch and also shifts the fundamental resonant frequencies to lower side. MPA consist of a thin metallic patch which is kept on dielectric substrate and below the dielectric substrate there is a conducting ground plane. A microstrip patch is generally of cooper placed on the top of the dielectric substrate. Ground plane is at the bottom side of the dielectric substrate. en_US
dc.language.iso en en_US
dc.publisher MCS en_US
dc.title Multiple Band Microstrip Patch Antenna for Satellite Communication en_US
dc.type Technical Report en_US


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