Development of Copper-Diamond-CNT Composites via Powder Metallurgical Route for Enhanced Strength and Thermal Conductivity

Abstract

The diamond-copper composite system has emerged as the most attractive material in the development of novel materials for thermal management applications. Due to the superior thermal conductivity of diamond/copper composite, the issue of heat dissipation in high heat flux situation is anticipated to be resolved in the future. In this study, the copper matrix composites reinforced with 0.5% Carbon Nanotubes (CNTs) and 3% diamond (D) particles were prepared via route of powder metallurgy. Diamond particles and CNTs were used as reinforcement. The chromium (Cr) powder was used to improve the interfacial bonding between the copper matrix and the diamond particle reinforcement. The sintering was conducted for all samples in a tube furnace having an argon gas environment. For Cr-D-CNT-Cr composites, the thermal conductivity was found to be 310 W/m K, which was higher as compared to Cu-D-Cr composite with an average value of 285 W/m K. Similarly, the Cr-D-CNT-Cr composites show 6 % higher compression and 10 % higher bending strength as compared to Cu-D-Cr composites, respectively.