Abstract:
The efficient and reliable performance of solid-state devices that are building blocks of integrated circuits have become critically important in an era of microprocessors. In order to ensure durable working conditions during operations, scaling these devices to the nanometer scale creates a challenging situation for designing and modeling. However, the presence of localized impurities and size miniaturization to the nanoscale regime has become significant, rendering traditional approaches to nanometer scale manufacturing and cooling inadequate. The influence of ever-more powerful technology on our culture is growing. To avoid premature component breakdown, the enormous heat generated by today's electronics must be drained.
For engineers, thermal design has become a great challenge. Cellphones, data centers, home electronics, telecommunications and other electronic devices need thermal management for their safe working. In order to meet the demand of users to have efficient gadgets, there must be an increase of power of critical electronic components.
