Synthesis and Study of Mechanical and Electrical Properties of Poly S.I.S/PPYV2O5 Polymeric Nano-Composites

Abstract

The increase in mechanical strength of polymer is comparatively higher at nano scale than large scale reinforcement. In current research scientist have work hard to develop polymer reinforced by nano particles and have obtained good results. The increase in mechanical strength can be improved by maintaining the fine dispersion of nano-particles within the polymer matrix and by the modification of the surface of nano-particles that act as reinforcement phase. Conducting polymers i-e polypyrrole, polythiophene, polyaniline or 3-methoxy derivative show electric conductivity due to the presence of p-system. These polymers have poly-conjugation showing electronic behavior of metals retaining their strength and processibility. Their conductivity can be increased by adding small amount of impurities i-e dopant into original polymer matrix. This can be done by p or n-type doping of polymer. Polypyrrole being conductive is stable to heat and environmental conditions and its chemical as well as electric oxidation is facile. The stability and electronic properties of polypyrrole can be increased by making blends with thermoplastic polymers. Polymers with conducting properties i-e polythiophene, polyaniline and polypyrrole are mixed with some thermoplastic polymer like polystyrene, polyvinylchloride help in enhancing stability. Nano-particles because of their high surface area show extensive interaction with any system they are dispersed in. Polymer nano composites are prepared by the incorporation of nano particles in to the polymer matrix here nano particles act as reinforcing phase. Nano particles increase the mechanical properties i-e Tensile strength, compressive strength, hardness, toughness, elasticity, plasticity etc. Polymer nano composites by enhancement of mechanical strength seek interest in variety of automotive and industrial applications i-e covers of various portable devices, vacuum cleaner blades and EMI shielding etc.