DSpace Home
→
E-Books
→
USPCAS-E
→
USPCAS-E E-Books
→
View Item

Modeling and Simulation for Microelectronic Packaging Assembly : Manufacturing, Reliability and Testing /

Liu, Sheng; Liu, Yong

URI: http://10.250.8.41:8080/xmlui/handle/123456789/49345

Date: 2011

Show full item record

Files in this item

Name: Sheng Liu, Yong ...

Size: 17.83Mb

Format: PDF

Description: E-book

This item appears in the following Collection(s)

USPCAS-E E-Books [4568]

Search DSpace

Advanced Search

Browse

All of DSpace
This Collection
- By Issue Date
- Authors
- Titles
- Subjects

My Account