Modeling and Simulation for Microelectronic Packaging Assembly : Manufacturing, Reliability and Testing /

dc.contributor.author	Liu, Sheng
dc.contributor.author	Liu, Yong
dc.date.accessioned	2025-01-30T05:55:42Z
dc.date.available	2025-01-30T05:55:42Z
dc.date.issued	2011
dc.identifier.isbn	978-0-470-82780-2 (hb); 978-0-470-82781-9 (ePDF)
dc.identifier.uri	http://10.250.8.41:8080/xmlui/handle/123456789/49345
dc.language.iso	en_US	en_US
dc.publisher	John Wiley & Sons (Asia) Pte Ltd.; Chemical Industry Press	en_US
dc.subject	Microelectronic packaging–Simulation methods	en_US
dc.title	Modeling and Simulation for Microelectronic Packaging Assembly : Manufacturing, Reliability and Testing /	en_US
dc.type	Book	en_US