DEVELOPMENT OF THERMAL CONDUCTIVE PASTE FOR HEAT TRANSFER IN ELECTRONIC DEVICES

Abstract

A major development in thermal compound technology, polymer-based thermal pastes provide a flexible means of achieving effective heat transmission in contemporary electronics. These pastes are essential for improving the effectiveness of heat transmission between high- performance components—like CPUs and GPUs—and the cooling systems that support them. In order to minimize overheating, which can result in decreased performance, a shorter lifespan, and perhaps component failure, effective heat dissipation is essential in electronic devices. In contrast to conventional metal-based pastes, these heat pastes are safe to use around fragile electronic components because the polymer matrices make them non- conductive. To make polymer-based thermal pastes the go-to option for a variety of crucial electronics applications, this research aims to maximize thermal paste conductivity, adhesion power, durability, and simplicity of application. Thermal pastes are commonly applied in areas such as computer processors, graphics cards, power electronics, and LED lighting systems, where effective heat management is necessary to preserve longevity and peak performance. It is still very difficult to get the required amount of heat conductivity without sacrificing other crucial material characteristics or processability. These restrictions may beovercome by carefully choosing fillers and composite formulations, which gives engineers more freedom to maximize thermal solutions without sacrificing dependability. Heat conductivity may be greatly increased by the use of fillers, and the selection of the matrix material is crucial in order to strike a balance between ease of application, flexibility, and adherence. Engineers may overcome these constraints and provide more freedom to enhance thermal solutions without sacrificing dependability by carefully choosing fillers and composite formulas. The optimal performance and efficacy of the thermal paste in practical applications is determined by the fillers' and matrix's synergy, which guarantees long-term stability and excellent heat dissipation. Although there are many other types of thermal interface materials (TIMs) on the market, including liquid metal compounds and thermal pads, thermal pastes are frequently more dependable because of their exceptional ability to conform to minute surface flaws, guaranteeing optimal heat transmission and contact between surfaces. Because of their dependability, polymer-based thermal pastes are the material of choice for many demanding and high performance electronic applications.